IEEE transactions on electronics packaging manufacturing (Print)

Other titles
Electronics packaging manufacturing; Transactions on electronics packaging manufacturing
Corp./Body Author
Institute of Electrical and Electronics Engineers.; Components, Packaging & Manufacturing Technology Society.
Place : Publisher

New York, NY : Institute of Electrical and Electronics Engineers (©1999-2010.)

From year - To year
1999-2010
Publication history
Vol. 22, no. 1 (Jan. 1999)-v. 33, no. 4 (Oct. 2010).
Type of resource
Periodical
Frequency
Quarterly
Language
English
Country of publication
United States
ISSN
1521-334X
ISSN-L
1521-334X
Codice Dewey code
621.381
Medium
Printed text
Journal public access
http://ieeexplore.ieee.org/servlet/opac?punumber=6104
Continues
IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing (Print)
Afterwards
IEEE transactions on components, packaging, and manufacturing technology (2011. Print)
Other physical media
IEEE transactions on electronics packaging manufacturing (Online)
Acnp cumulative hol.
1999-2010.
Journal CNR code
P 00202405
Journal ACNP code
1087971
Permalink
http://acnpsearch.tweb-dev.unibo.it/journal/1087971
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