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Results: 1-25/78
Authors:
Dittes, M
Citation: M. Dittes, Green packages - Requirements, materials, results, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 1-5
Authors:
Garner, CM
Gupta, V
Bissessur, V
Kumar, A
Aspandiar, R
Citation: Cm. Garner et al., Challenges in converting to lead-free electronics, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 6-9
Authors:
Solberg, V
Citation: V. Solberg, Board level reliability testing of mu BGA (R) packaging with lead-free solder attachment, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 10-14
Authors:
Cada, LG
Lalanto, R
Coronel, G
San Gregorio, V
Asis, D
Ong, G
Ducusin, C
Desengano, R
Llamas, T
Decena, R
Canares, N
Reyes, A
Miciano, P
Citation: Lg. Cada et al., Manufacturability and reliability of non-halogenated molding compounds, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 15-20
Authors:
Tummala, RR
Wong, CP
Chan, YC
Citation: Rr. Tummala et al., Microelectronic packaging and assembly roadmap for Hong Kong and Pearl River Delta region: A team study and recommendations, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 21-23
Authors:
Beelen-Hendrikx, C
Verguld, M
Citation: C. Beelen-hendrikx et M. Verguld, Trends in electronic packaging and assembly for portable consumer products, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 24-32
Authors:
Yeoh, HP
Lii, MJ
Sankman, B
Azimi, H
Citation: Hp. Yeoh et al., Flip chip pin grid array (FC-PGA) packaging technology, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 33-40
Authors:
Aschenbrenner, R
Ostmann, A
Jung, E
Landesberger, C
Reichl, H
Citation: R. Aschenbrenner et al., A new approach for system integrated packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 41-45
Authors:
Szekely, V
Rencz, M
Poppe, A
Courtois, B
Citation: V. Szekely et al., New hardware tools for the thermal transient testing of packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 46-52
Authors:
Cheah, TS
Seetharamu, KN
Ghulam, AQ
Zainal, ZA
Sundararajan, T
Citation: Ts. Cheah et al., Numerical modeling of microscale heat conduction effects in electronic package for different thermal boundary conditions, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 53-59
Authors:
Khan, N",Pinjala,"Iyer, MK
Chuan, TK
Jin, WX
Citation: Mk. Khan, N",pinjala,"iyer et al., Thermal enhancement of desk top computer by chassis design optimization, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 60-64
Authors:
Goh, TJ
Amir, AN
Chiu, CP
Torresola, J
Citation: Tj. Goh et al., Cartridge thermal design of Pentium (R) !!! processor for workstation: Giga hertz technology envelope extension challenges, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 65-71
Authors:
Chan, CF
Lahiri, SK
Yuan, P
How, JBH
Citation: Cf. Chan et al., An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 72-80
Authors:
Kim, SJ
Bae, KS
Citation: Sj. Kim et Ks. Bae, Interdiffusion between Cu and Sn-rich solder: Dominant diffusion species, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 81-85
Authors:
Huang, XJ
Lee, SWR
Tse, WS
Citation: Xj. Huang et al., Experimental characterization for the shear strength of Pb-free solder balls on a PZT substrate with Pd/Ag pads, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 86-90
Authors:
Ohnuma, I
Liu, XJ
Ohtani, H
Anzai, K
Kainuma, R
Ishida, K
Citation: I. Ohnuma et al., Development of thermodynamic database for micro-soldering alloys, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 91-96
Authors:
Bailey, C
Lu, H
Wheeler, D
Citation: C. Bailey et al., Predicting the movement of voids in solder bumps and subsequent reliability, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 97-102
Authors:
Mannan, SH
Wheeler, D
Hutt, DA
Whalley, DC
Conway, PP
Bailey, C
Citation: Sh. Mannan et al., Solder paste reflow modeling for flip chip assembly, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 103-109
Authors:
Chiang, KN
Chang, CW
Lin, JD
Citation: Kn. Chiang et al., Analysis of ACA/ACF package using equivalent spring method, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 110-116
Authors:
Dreyer, W
Muller, WH
Citation: W. Dreyer et Wh. Muller, Quantitative modeling of diffusional coarsening in eutectic tin/lead solders, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 117-123
Authors:
Long, TK
Li, GM
Seetharamu, KN
Hassan, AY
Citation: Tk. Long et al., A fresh look at thermal resistance in electronic packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 124-130
Authors:
Loh, CV
Toh, KC
Pinjala, D
Iyer, MK
Citation: Cv. Loh et al., Development of effective compact models for depopulated ball grid array packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 131-137
Authors:
Parthiban, A
Jeevan, K
Seetharamu, KN
Azid, IA
Citation: A. Parthiban et al., Evolutionary genetic approach to determine junction temperature in electronic packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 138-143
Authors:
Pinjala, D
Iyer, MK
Guan, CS
Rasiah, IJ
Citation: D. Pinjala et al., Thermal characterization of vias using compact models, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 144-147
Authors:
Zhu, H
Guo, YF
Li, WY
Tseng, AA
Martin, B
Citation: H. Zhu et al., Micro-mechanical characterization of solder mask materials, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 148-153