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Results: 26-50/78
Authors:
Khong, YL
Lee, HL
Citation: Yl. Khong et Hl. Lee, Chemical imaging of micro-vias in organic packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 154-158
Authors:
Chen, J
Chan, M
De Wolf, I
Citation: J. Chen et al., Local stress measurements in packaging by Raman spectroscopy, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 159-162
Authors:
Xie, HM
Chai, GB
Asundi, A
Jin, Y
Lu, YG
Ngoi, BKA
Zhong, ZW
Citation: Hm. Xie et al., Thermal deformation measurement of electronic package using advanced moiremethods, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 163-168
Authors:
Kuhnlein, G
Bos, A
Citation: G. Kuhnlein et A. Bos, A design and manufacturing solution for high reliable non-leaded CSP's like QFN, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 169-175
Authors:
Mena, MG
Citation: Mg. Mena, ADI-FMM, a customized FMEA for process management in the IC assembly and test industy, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 176-180
Authors:
Wei, JB
Fathi, Z
Pan, B
Nah, CK
Chan, SL
Citation: Jb. Wei et al., Use of microwave technology for rapid cure of chip-on-board glob top encapsulants, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 181-185
Authors:
Sze, HP
Rasiah, IJ
Citation: Hp. Sze et Ij. Rasiah, Correlation of underfill viscosity and contact angle on surfaces in a flipchip package, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 186-190
Authors:
Kim, W
Swaminathan, M
Li, YL
Citation: W. Kim et al., Extraction of the frequency-dependent characteristic impedance of transmission lines using TDR measurements, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 191-197
Authors:
Ryu, WW
Wai, ALC
Wei, F
Kim, J
Citation: Ww. Ryu et al., Applications of a 3-D field solver for on-chip and package microstrip interconnection design, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 198-203
Authors:
Wong, A
Linton, D
Citation: A. Wong et D. Linton, Application of SU-8 in flip chip bump micromachining for millimeter wave applications, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 204-209
Authors:
Yeo, YK
Lee, SY
Iyer, MK
Leong, MS
Citation: Yk. Yeo et al., A comparative study of different plane modelling methodologies for high density electronic packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 210-213
Authors:
Wong, CP
Lu, D
Citation: Cp. Wong et D. Lu, Development of solder replacement isotropic conductive adhesives, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 214-222
Authors:
Wang, YP
Chai, K
Her, TD
Lo, R
Citation: Yp. Wang et al., Evaluating underfill material for flip chip ball grid array package, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 223-227
Authors:
Tat, QH
Rasiah, IJ
Citation: Qh. Tat et Ij. Rasiah, The study of cyanate ester underfill adhesives under typical flip chip assembly process conditions, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 228-233
Authors:
Zhang, ZQ
Wong, CP
Citation: Zq. Zhang et Cp. Wong, Development of no-flow underfill for lead-free bumped flip-chip assemblies, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 234-240
Authors:
Pyland, J
Pucha, R
Sitaraman, S
Citation: J. Pyland et al., Does underfilling enhance BGA reliability?, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 241-245
Authors:
Song, JY
Yu, J
Citation: Jy. Song et J. Yu, Measurements of metal/polymer interfacial fracture energy in microelectronics packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 246-250
Authors:
Yang, JH
Lee, KY
Citation: Jh. Yang et Ky. Lee, Cracking analysis of plastic IC package in consideration of viscoelasticity, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 251-257
Authors:
Wong, EH
Koh, SW
Rajoo, R
Lim, TB
Citation: Eh. Wong et al., Underfill swelling and temperature-humidity performance of flip chip PBGA package, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 258-262
Authors:
Zhang, GQ
Tay, AAO
Ernst, LJ
Citation: Gq. Zhang et al., Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 263-269
Authors:
Tay, AAO
Lee, KH
Zhou, W
Lim, KM
Citation: Aao. Tay et al., A methodology for predicting failure sites and failure modes in an IC package, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 270-276
Authors:
Wong, WH
Cheng, L
Citation: Wh. Wong et L. Cheng, Initiation and propagation of interface delamination in plastic IC packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 277-282
Authors:
Nakamura, K
Harazono, M
Yamashita, H
Ding, DH
Baker, J
Dubey, A
Citation: K. Nakamura et al., Flip chip pad structure for high density organic build up substrate, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 283-285
Authors:
Tomita, Y
Tago, M
Nemoto, Y
Takahashi, K
Citation: Y. Tomita et al., Copper bump bonding with electroless metal cap on 3 dimensional stacked structure, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 286-291
Authors:
Uang, RH
Chen, KC
Lu, SW
Hu, HT
Huang, SH
Citation: Rh. Uang et al., The reliability performance of low cost bumping on aluminum and copper wafer, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 292-296