Table of contents of journal:

Results: 76-78/78

Elimination of lead in first level semiconductor packaging

Authors: Cognetti, C

Citation: C. Cognetti, Elimination of lead in first level semiconductor packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 452-456

Low cost options for next generation packaging

Authors: Vardaman, EJ

Citation: Ej. Vardaman, Low cost options for next generation packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 457-459

Impact of 3G communication on IC packaging

Authors: Banerji, K

Citation: K. Banerji, Impact of 3G communication on IC packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 460-461

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