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Results: 1-25/26
Authors:
Paunovic, M
Citation: M. Paunovic, Fundamental considerations, ELEC SOC S, 2000, pp. 1-60
Authors:
Dini, JW
Citation: Jw. Dini, Electrodeposition of copper, ELEC SOC S, 2000, pp. 61-138
Authors:
Di Bari, GA
Citation: Ga. Di Bari, Electrodeposition of nickel, ELEC SOC S, 2000, pp. 139-199
Authors:
Kohl, PA
Citation: Pa. Kohl, Electrodeposition of gold, ELEC SOC S, 2000, pp. 201-225
Authors:
Schlesinger, M
Citation: M. Schlesinger, Electroless and electrodeposition of silver, ELEC SOC S, 2000, pp. 227-239
Authors:
Zhang, Y
Abys, JA
Citation: Y. Zhang et Ja. Abys, Tin and tin alloys for lead-free solder, ELEC SOC S, 2000, pp. 241-287
Authors:
Mandich, NV
Snyder, DL
Citation: Nv. Mandich et Dl. Snyder, Electrodeposition of chromium, ELEC SOC S, 2000, pp. 289-360
Authors:
Jordan, M
Citation: M. Jordan, Electrodeposition of lead and lead alloys, ELEC SOC S, 2000, pp. 361-386
Authors:
Jordan, M
Citation: M. Jordan, Electrodeposition of tin-lead alloys, ELEC SOC S, 2000, pp. 387-422
Authors:
Winand, R
Citation: R. Winand, Electrodeposition of zinc and zinc alloys, ELEC SOC S, 2000, pp. 423-460
Authors:
Izaki, M
Citation: M. Izaki, Electrodeposition of iron and iron alloys, ELEC SOC S, 2000, pp. 461-481
Authors:
Abys, JA
Dullaghan, CA
Citation: Ja. Abys et Ca. Dullaghan, Electrodeposition of palladium and palladium alloys, ELEC SOC S, 2000, pp. 483-553
Authors:
Di Bari, GA
Citation: Ga. Di Bari, Nickel alloys, cobalt, and cobalt alloys, ELEC SOC S, 2000, pp. 555-583
Authors:
Schlesinger, TE
Citation: Te. Schlesinger, Electrodeposition of semiconductors, ELEC SOC S, 2000, pp. 585-612
Authors:
Schlesinger, M
Citation: M. Schlesinger, Deposition on nonconductors, ELEC SOC S, 2000, pp. 613-622
Authors:
Osaka, T
Komaba, S
Momma, T
Citation: T. Osaka et al., Electroplating of organic films: Conductive polymers, ELEC SOC S, 2000, pp. 623-643
Authors:
Paunovic, M
Citation: M. Paunovic, Electroless deposition of copper, ELEC SOC S, 2000, pp. 645-665
Authors:
Schlesinger, M
Citation: M. Schlesinger, Electroless deposition of nickel, ELEC SOC S, 2000, pp. 667-684
Authors:
Osaka, T
Homma, T
Yokoshima, T
Citation: T. Osaka et al., Electroless deposition of cobalt alloy films, ELEC SOC S, 2000, pp. 685-697
Authors:
Ohno, I
Citation: I. Ohno, Electroless deposition of palladium and platinum, ELEC SOC S, 2000, pp. 699-704
Authors:
Okinaka, Y
Kato, M
Citation: Y. Okinaka et M. Kato, Electroless deposition of gold, ELEC SOC S, 2000, pp. 705-728
Authors:
Ohno, I
Citation: I. Ohno, Electroless deposition of alloys, ELEC SOC S, 2000, pp. 729-737
Authors:
Snyder, DD
Citation: Dd. Snyder, Preparation for deposition, ELEC SOC S, 2000, pp. 739-748
Authors:
Turner, DR
Citation: Dr. Turner, Manufacturing technologies, ELEC SOC S, 2000, pp. 749-767
Authors:
Turner, DR
Citation: Dr. Turner, Monitoring and control, ELEC SOC S, 2000, pp. 769-790