Authors:
MA JB
DRAGON J
VANDERVEER W
ENTENBERG A
LINDBERG V
ANSCHEL M
SHIH DY
LAURO P
Citation: Jb. Ma et al., USE OF HIGH-TEMPERATURE AND HIGH HUMIDITY TO TEST THE ADHESION OF SPUTTERED COPPER TO A POLYIMIDE SURFACE-MODIFIED BY AN AC NITROGEN GLOW-DISCHARGE, Journal of adhesion science and technology, 9(4), 1995, pp. 487-499
Citation: M. Anschel et Pd. Murphy, HYDROTHERMAL DEGRADATION AND THERMAL REGENERATION OF AN AMINOSILANE INTERFACE USED TO COUPLE POLYIMIDE TO ALUMINA, Journal of adhesion science and technology, 8(7), 1994, pp. 787-806