Authors:
MCCORMACK M
ARTAKI I
JIN S
JACKSON AM
MACHUSAK DM
KAMMLOTT GW
FINLEY DW
Citation: M. Mccormack et al., WAVE SOLDERING WITH A LOW-MELTING POINT BI-SN ALLOY - EFFECTS OF SOLDERING TEMPERATURES AND CIRCUIT-BOARD FINISHES, Journal of electronic materials, 25(7), 1996, pp. 1128-1131
Citation: U. Ray et al., INFLUENCE OF TEMPERATURE AND HUMIDITY ON THE WETTABILITY OF IMMERSIONTIN-COATED PRINTED WIRING BOARDS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(1), 1995, pp. 153-162
Citation: U. Ray et al., THE INFLUENCE OF TEMPERATURE AND HUMIDITY ON PRINTED WIRING BOARD SURFACE FINISHES - IMMERSION TIN VS ORGANIC AZOLES, Journal of electronic materials, 23(8), 1994, pp. 779-785