AAAAAA

   
Results: 1-4 |
Results: 4

Authors: MCCORMACK M ARTAKI I JIN S JACKSON AM MACHUSAK DM KAMMLOTT GW FINLEY DW
Citation: M. Mccormack et al., WAVE SOLDERING WITH A LOW-MELTING POINT BI-SN ALLOY - EFFECTS OF SOLDERING TEMPERATURES AND CIRCUIT-BOARD FINISHES, Journal of electronic materials, 25(7), 1996, pp. 1128-1131

Authors: RAY U ARTAKI I VIANCO PT
Citation: U. Ray et al., INFLUENCE OF TEMPERATURE AND HUMIDITY ON THE WETTABILITY OF IMMERSIONTIN-COATED PRINTED WIRING BOARDS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(1), 1995, pp. 153-162

Authors: ARTAKI I JACKSON AM VIANCO PT
Citation: I. Artaki et al., EVALUATION OF LEAD-FREE SOLDER JOINTS IN ELECTRONIC ASSEMBLIES, Journal of electronic materials, 23(8), 1994, pp. 757-764

Authors: RAY U ARTAKI I GORDON HM VIANCO PT
Citation: U. Ray et al., THE INFLUENCE OF TEMPERATURE AND HUMIDITY ON PRINTED WIRING BOARD SURFACE FINISHES - IMMERSION TIN VS ORGANIC AZOLES, Journal of electronic materials, 23(8), 1994, pp. 779-785
Risultati: 1-4 |