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Results: 1-22 |
Results: 22
Characterization of thin photosensitive polyimide films for future metallization schemes
Authors: Alford, TL Zou, YL Gadre, KS Theodore, ND Chen, W
Citation: Tl. Alford et al., Characterization of thin photosensitive polyimide films for future metallization schemes, J VAC SCI B, 19(4), 2001, pp. 1253-1258
Integration and electrical characterization of photosensitive polyimide
Authors: Alford, TL Zou, YL Gadre, KS King, C Chen, W Theodore, DN
Citation: Tl. Alford et al., Integration and electrical characterization of photosensitive polyimide, J VAC SCI B, 19(3), 2001, pp. 774-779
Novel technique to pattern silver using CF4 and CF4/O-2 glow discharges
Authors: Nguyen, P Zeng, YX Alford, TL
Citation: P. Nguyen et al., Novel technique to pattern silver using CF4 and CF4/O-2 glow discharges, J VAC SCI B, 19(1), 2001, pp. 158-165
Potentiation of antitumor activity of irinotecan by chemically modified oligonucleotides
Authors: Agrawal, S Kandimalla, ER Yu, D Hollister, BA Chen, SF Dexter, DL Alford, TL Hill, B Bailey, KS Bono, CP Knoerzer, DL Morton, PA
Citation: S. Agrawal et al., Potentiation of antitumor activity of irinotecan by chemically modified oligonucleotides, INT J ONCOL, 18(5), 2001, pp. 1061-1069
Crystallization kinetics of sol-gel derived hydroxyapatite thin films
Authors: Lopatin, CM Pizziconi, VB Alford, TL
Citation: Cm. Lopatin et al., Crystallization kinetics of sol-gel derived hydroxyapatite thin films, J MAT S-M M, 12(9), 2001, pp. 767-773
Advanced silver-based metallization patterning for ULSI applications
Authors: Alford, TL Nguyen, P Zeng, YX Mayer, JW
Citation: Tl. Alford et al., Advanced silver-based metallization patterning for ULSI applications, MICROEL ENG, 55(1-4), 2001, pp. 383-388
Self-encapsulation effects on the electromigration resistance of silver lines
Authors: Alford, TL Zeng, YX Nguyen, P Chen, LH Mayer, JW
Citation: Tl. Alford et al., Self-encapsulation effects on the electromigration resistance of silver lines, MICROEL ENG, 55(1-4), 2001, pp. 389-395
Investigation of the effects of different annealing ambients on Ag/Al bilayers: Electrical properties and morphology
Authors: Malgas, GF Adams, D Nguyen, P Wang, Y Alford, TL Mayer, JW
Citation: Gf. Malgas et al., Investigation of the effects of different annealing ambients on Ag/Al bilayers: Electrical properties and morphology, J APPL PHYS, 90(11), 2001, pp. 5591-5598
Agglomeration and percolation conductivity
Authors: Sieradzki, K Bailey, K Alford, TL
Citation: K. Sieradzki et al., Agglomeration and percolation conductivity, APPL PHYS L, 79(21), 2001, pp. 3401-3403
Use of TiN(O)/Ti as an effective intermediate stress buffer and diffusion barrier for Cu/parylene-n interconnects
Authors: Gadre, KS Alford, TL Mayer, JW
Citation: Ks. Gadre et al., Use of TiN(O)/Ti as an effective intermediate stress buffer and diffusion barrier for Cu/parylene-n interconnects, APPL PHYS L, 79(20), 2001, pp. 3260-3262
Direct patterning of nanometer-scale silicide structures on silicon by ion-beam implantation through a thin barrier layer
Authors: Mitan, MM Pivin, DP Alford, TL Mayer, JW
Citation: Mm. Mitan et al., Direct patterning of nanometer-scale silicide structures on silicon by ion-beam implantation through a thin barrier layer, APPL PHYS L, 78(18), 2001, pp. 2727-2729
Thermal stability and adhesion improvement of Ag deposited on Pa-n by oxygen plasma treatment
Authors: Gadre, KS Alford, TL
Citation: Ks. Gadre et Tl. Alford, Thermal stability and adhesion improvement of Ag deposited on Pa-n by oxygen plasma treatment, J VAC SCI B, 18(6), 2000, pp. 2814-2819
Real-time composition control of InAlAs grown on InP using spectroscopic ellipsometry
Authors: Beaudoin, M Grassi, E Johnson, SR Ramaswamy, K Tsakalis, K Alford, TL Zhang, YH
Citation: M. Beaudoin et al., Real-time composition control of InAlAs grown on InP using spectroscopic ellipsometry, J VAC SCI B, 18(3), 2000, pp. 1435-1438
Effectiveness of Ti, TiN, Ta, TaN, and W2N as barriers for the integrationof low-k dielectric hydrogen silsesquioxane
Authors: Zeng, YX Russell, SW McKerrow, AJ Chen, LH Alford, TL
Citation: Yx. Zeng et al., Effectiveness of Ti, TiN, Ta, TaN, and W2N as barriers for the integrationof low-k dielectric hydrogen silsesquioxane, J VAC SCI B, 18(1), 2000, pp. 221-230
Processing and encapsulation of silver patterns by using reactive ion etchand ammonia anneal
Authors: Zeng, YX Chen, LH Zou, YL Nguyen, PA Hansen, JD Alford, TL
Citation: Yx. Zeng et al., Processing and encapsulation of silver patterns by using reactive ion etchand ammonia anneal, MATER CH PH, 66(1), 2000, pp. 77-82
Enhancement of Ag electromigration resistance by a novel encapsulation process
Authors: Zeng, YX Chen, LH Zou, YL Nyugen, PA Hansen, JD Alford, TL
Citation: Yx. Zeng et al., Enhancement of Ag electromigration resistance by a novel encapsulation process, MATER LETT, 45(3-4), 2000, pp. 157-161
Thin film interaction between low-k dielectric hydrogen silsesquioxane (HSQ) and Ti barrier layer
Authors: Zeng, YX Russell, SW McKerrow, AJ Chen, PJ Alford, TL
Citation: Yx. Zeng et al., Thin film interaction between low-k dielectric hydrogen silsesquioxane (HSQ) and Ti barrier layer, THIN SOL FI, 360(1-2), 2000, pp. 283-292
Sheet resistance modeling of the Ti/SiO2 system upon high temperature annealing
Authors: Zeng, YX Chen, LH Alford, TL
Citation: Yx. Zeng et al., Sheet resistance modeling of the Ti/SiO2 system upon high temperature annealing, APPL PHYS L, 76(1), 2000, pp. 64-66
Reactive ion etch of patterned and blanket silver thin films in Cl-2/O-2 and O-2 glow discharges
Authors: Nguyen, P Zeng, YX Alford, TL
Citation: P. Nguyen et al., Reactive ion etch of patterned and blanket silver thin films in Cl-2/O-2 and O-2 glow discharges, J VAC SCI B, 17(5), 1999, pp. 2204-2209
Kinetics of Ag/Al bilayer self-encapsulation
Authors: Wang, Y Alford, TL Mayer, JW
Citation: Y. Wang et al., Kinetics of Ag/Al bilayer self-encapsulation, J APPL PHYS, 86(10), 1999, pp. 5407-5412
Formation of aluminum oxynitride diffusion barriers for Ag metallization
Authors: Wang, Y Alford, TL
Citation: Y. Wang et Tl. Alford, Formation of aluminum oxynitride diffusion barriers for Ag metallization, APPL PHYS L, 74(1), 1999, pp. 52-54
Ion-beam densification of hydroxyapatite thin films
Authors: Lopatin, CM Alford, TL Pizziconi, VB Kuan, M Laursen, T
Citation: Cm. Lopatin et al., Ion-beam densification of hydroxyapatite thin films, NUCL INST B, 145(4), 1998, pp. 522-531
Risultati: 1-22 |