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Results: 3
Photopolymerizable liquid encapsulants for microelectronic devices
Authors: Baikerikar, KK Scranton, AB
Citation: Kk. Baikerikar et Ab. Scranton, Photopolymerizable liquid encapsulants for microelectronic devices, POLYMER, 42(2), 2001, pp. 431-441
Photopolymerizable liquid encapsulants for microelectronic devices: Thermal and mechanical properties of systems with reduced in-mold cure times
Authors: Baikerikar, KK Scranton, AB
Citation: Kk. Baikerikar et Ab. Scranton, Photopolymerizable liquid encapsulants for microelectronic devices: Thermal and mechanical properties of systems with reduced in-mold cure times, J APPL POLY, 81(14), 2001, pp. 3449-3461
Viscosity characterization of highly filled photopolymerizable liquid encapsulants for microelectronic devices
Authors: Baikerikar, KK Scranton, AB
Citation: Kk. Baikerikar et Ab. Scranton, Viscosity characterization of highly filled photopolymerizable liquid encapsulants for microelectronic devices, POLYM COMP, 21(2), 2000, pp. 297-304
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