Authors: Lall, P Banerji, K

Citation: P. Lall et K. Banerji, Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages, MICROEL REL, 40(7), 2000, pp. 1081-1095

Authors: Banerji, K

Citation: K. Banerji, Impact of 3G communication on IC packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 460-461