Authors:
Bruckner, W
Baunack, S
Hecker, M
Monch, JI
van Loyen, L
Schneider, CM
Citation: W. Bruckner et al., Interdiffusion in NiFe/Cu/NiFe trilayers: Possible failure mechanism for magnetoelectronic devices (vol 77, pg 358, 2000), APPL PHYS L, 77(7), 2000, pp. 1064-1064
Authors:
Bruckner, W
Baunack, S
Hecker, M
Monch, JI
van Loyen, L
Schneider, CM
Citation: W. Bruckner et al., Interdiffusion in NiFe/Cu/NiFe trilayers: Possible failure mechanism for magnetoelectronic devices, APPL PHYS L, 77(3), 2000, pp. 358-360
Authors:
Bruckner, W
Pitschke, W
Baunack, S
Thomas, J
Citation: W. Bruckner et al., Mechanical stress, grain-boundary relaxation, and oxidation of sputtered CuNi(Mn) films, J MATER RES, 14(4), 1999, pp. 1286-1294
Authors:
Baunack, S
Bruckner, W
Pitschke, W
Thomas, J
Citation: S. Baunack et al., Auger electron spectroscopy study of interdiffusion, oxidation and segregation during thermal treatment of NiCr/CuNi(Mn)/NiCr thin films, APPL SURF S, 145, 1999, pp. 216-221
Citation: B. Wolf et al., Hillock growth phenomena during post-indentation annealing of quasicrystalline AlPdMn, PHYS ST S-A, 172(2), 1999, pp. 317-327