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Results:
1-3
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Results: 3
Measurement and instrumentation
Authors:
Datta, AK Berek, H Little, DA Ramaswamy, HS
Citation:
Ak. Datta et al., Measurement and instrumentation, FOOD SCI, 109, 2001, pp. 279-298
Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism
Authors:
Dudek, R Berek, H Fritsch, T Michel, B
Citation:
R. Dudek et al., Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism, IEEE T COMP, 23(3), 2000, pp. 462-469
Protection against corrosion of wire bonds in different environment by glob topping
Authors:
Berek, H Fritzsch, T Schneider, W
Citation:
H. Berek et al., Protection against corrosion of wire bonds in different environment by glob topping, MATER CORRO, 51(12), 2000, pp. 875-879
Risultati:
1-3
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