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Results: 3
Study of a mechanically clamped cryo-chuck device in a high density plasmafor deep anisotropic etching of silicon
Authors:
Hibert, C Aachboun, S Boufnichel, M Ranson, P
Citation:
C. Hibert et al., Study of a mechanically clamped cryo-chuck device in a high density plasmafor deep anisotropic etching of silicon, J VAC SCI A, 19(2), 2001, pp. 646-650
Cryogenic etching of deep narrow trenches in silicon
Authors:
Aachboun, S Ranson, P Hilbert, C Boufnichel, M
Citation:
S. Aachboun et al., Cryogenic etching of deep narrow trenches in silicon, J VAC SCI A, 18(4), 2000, pp. 1848-1852
Etching a single micrometer-size particle in a plasma
Authors:
Stoffels, WW Stoffels, E Swinkels, GHPM Boufnichel, M Kroesen, GMW
Citation:
Ww. Stoffels et al., Etching a single micrometer-size particle in a plasma, PHYS REV E, 59(2), 1999, pp. 2302-2304
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