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Results: 1-8 |
Results: 8
USING LASER DEFECT AVOIDANCE TO BUILD LARGE-AREA FPGAS
Authors: CHAPMAN GH DUFORT B
Citation: Gh. Chapman et B. Dufort, USING LASER DEFECT AVOIDANCE TO BUILD LARGE-AREA FPGAS, IEEE design & test of computers, 15(4), 1998, pp. 75-81
FOREWORD - CONTRIBUTIONS FROM THE INTERNATIONAL-CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON (ISIS-96)
Authors: SCIUTO D TEWKSBURY SK CHAPMAN GH
Citation: D. Sciuto et al., FOREWORD - CONTRIBUTIONS FROM THE INTERNATIONAL-CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON (ISIS-96), IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 298-299
EFFECTS OF SCANNING AND BIASING CIRCUIT RESTRUCTURING ON THE RESPONSEOF A LARGE-AREA MAGNETIC-FIELD SENSOR ARRAY
Authors: AUDET Y CHAPMAN GH
Citation: Y. Audet et Gh. Chapman, EFFECTS OF SCANNING AND BIASING CIRCUIT RESTRUCTURING ON THE RESPONSEOF A LARGE-AREA MAGNETIC-FIELD SENSOR ARRAY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 342-348
SPECIAL SECTION ON THE IEEE WAFER-SCALE INTEGRATION CONFERENCE (WSI95) - FOREWORD
Authors: TEWKSBURY TK CHAPMAN GH
Citation: Tk. Tewksbury et Gh. Chapman, SPECIAL SECTION ON THE IEEE WAFER-SCALE INTEGRATION CONFERENCE (WSI95) - FOREWORD, IEEE transactions on very large scale integration (VLSI) systems, 5(1), 1997, pp. 1-2
YIELD IMPROVEMENT OF A LARGE-AREA MAGNETIC-FIELD SENSORY ARRAY SUING REDUNDANCY SCHEMES
Authors: AUDET Y CHAPMAN GH
Citation: Y. Audet et Gh. Chapman, YIELD IMPROVEMENT OF A LARGE-AREA MAGNETIC-FIELD SENSORY ARRAY SUING REDUNDANCY SCHEMES, IEEE transactions on very large scale integration (VLSI) systems, 5(1), 1997, pp. 28-33
WAFER-SCALE INTEGRATION - FOREWORD
Authors: CHAPMAN GH BREWER JE TEWKSBURY SK
Citation: Gh. Chapman et al., WAFER-SCALE INTEGRATION - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 404-405
TEST VEHICLE FOR A WAFER-SCALE FIELD-PROGRAMMABLE GATE ARRAY
Authors: DUFORT B CHAPMAN GH
Citation: B. Dufort et Gh. Chapman, TEST VEHICLE FOR A WAFER-SCALE FIELD-PROGRAMMABLE GATE ARRAY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 431-437
TEST VEHICLE FOR A WAFER-SCALE THERMAL PIXEL SCENE SIMULATOR
Authors: CHAPMAN GH CARR LS SYRZYCKI MJ DUFORT B
Citation: Gh. Chapman et al., TEST VEHICLE FOR A WAFER-SCALE THERMAL PIXEL SCENE SIMULATOR, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(3), 1994, pp. 334-341
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