AAAAAA

   
Results: 1-25 | 26-30 |
Results: 26-30/30

Authors: CHEN AS NGUYEN LT GEE SA
Citation: As. Chen et al., EFFECT OF MATERIAL INTERACTIONS DURING THERMAL-SHOCK TESTING ON IC PACKAGE RELIABILITY, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 932-939

Authors: CHEN AS HARRIS B
Citation: As. Chen et B. Harris, FATIGUE-INDUCED DAMAGE MECHANISMS IN CARBON FIBER-REINFORCED PLASTIC COMPOSITES, Journal of Materials Science, 28(8), 1993, pp. 2013-2027

Authors: NGUYEN LT LO RHY CHEN AS BELANI JG
Citation: Lt. Nguyen et al., MOLDING COMPOUND TRENDS IN A DENSER PACKAGING WORLD - QUALIFICATION TESTS AND RELIABILITY CONCERNS, IEEE transactions on reliability, 42(4), 1993, pp. 518-535

Authors: CHEN AS MATTHEWS FL
Citation: As. Chen et Fl. Matthews, A REVIEW OF MULTIAXIAL BIAXIAL LOADING TESTS FOR COMPOSITE-MATERIALS, Composites, 24(5), 1993, pp. 395-406

Authors: HUIE ML CHEN AS GRIX AW HIRSCHHORN R
Citation: Ml. Huie et al., DE-NOVO MUTATION (13-NT DELETION) RESULTING IN INFANTILE GSDII (POMPE) IN A CHILD CARRYING A MISSENSE MUTATION ON THE OTHER ALLELE, American journal of human genetics, 53(3), 1993, pp. 906-906
Risultati: 1-25 | 26-30 |