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Results: 5

Authors: SARVAR F CONWAY PP
Citation: F. Sarvar et Pp. Conway, A MODELING TOOL FOR THE THERMAL OPTIMIZATION OF THE REFLOW SOLDERING OF PRINTED-CIRCUIT ASSEMBLIES, Finite elements in analysis and design, 30(1-2), 1998, pp. 47-63

Authors: CONWAY PP KALANTARY MR WILLIAMS DJ
Citation: Pp. Conway et al., EXPERIMENTAL INVESTIGATION OF THE FORMATION OF SURFACE-MOUNT SOLDER JOINTS, Journal of electronic packaging, 118(4), 1996, pp. 223-228

Authors: WHALLEY DC CONWAY PP
Citation: Dc. Whalley et Pp. Conway, SIMULATION AND INTERPRETATION OF WETTING BALANCE TESTS USING THE SURFACE EVOLVER, Journal of electronic packaging, 118(3), 1996, pp. 134-141

Authors: TILLEY KJ WILLIAMS DJ CONWAY PP
Citation: Kj. Tilley et al., DESIGN AND MANUFACTURE BY FOREIGN ELECTRONICS MULTI-NATIONALS IN SINGAPORE AND TAIWAN - PRODUCT RESPONSIBILITIES IN A GLOBAL ENVIRONMENT, Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture, 210(3), 1996, pp. 221-231

Authors: WILLIAMS DJ CONWAY PP WHALLEY DC
Citation: Dj. Williams et al., MAKING CIRCUITS MORE THAN ONCE - THE MANUFACTURING CHALLENGES OF ELECTRONICS INTENSIVE PRODUCTS, Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture, 207(2), 1993, pp. 83-90
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