Authors:
HAMIDI A
COQUERY G
LALLEMAND R
VALES P
DORKEL JM
Citation: A. Hamidi et al., TEMPERATURE-MEASUREMENTS AND THERMAL MODELING OF HIGH-POWER IGBT MULTICHIP MODULES FOR RELIABILITY INVESTIGATIONS IN TRACTION APPLICATIONS, Microelectronics and reliability, 38(6-8), 1998, pp. 1353-1359
Citation: A. Hamidi et G. Coquery, EFFECTS OF CURRENT-DENSITY AND CHIP TEMPERATURE DISTRIBUTION ON LIFETIME OF HIGH-POWER IGBT MODULES IN TRACTION WORKING-CONDITIONS, Microelectronics and reliability, 37(10-11), 1997, pp. 1755-1758