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Results: 2
TEMPERATURE-MEASUREMENTS AND THERMAL MODELING OF HIGH-POWER IGBT MULTICHIP MODULES FOR RELIABILITY INVESTIGATIONS IN TRACTION APPLICATIONS
Authors: HAMIDI A COQUERY G LALLEMAND R VALES P DORKEL JM
Citation: A. Hamidi et al., TEMPERATURE-MEASUREMENTS AND THERMAL MODELING OF HIGH-POWER IGBT MULTICHIP MODULES FOR RELIABILITY INVESTIGATIONS IN TRACTION APPLICATIONS, Microelectronics and reliability, 38(6-8), 1998, pp. 1353-1359
EFFECTS OF CURRENT-DENSITY AND CHIP TEMPERATURE DISTRIBUTION ON LIFETIME OF HIGH-POWER IGBT MODULES IN TRACTION WORKING-CONDITIONS
Authors: HAMIDI A COQUERY G
Citation: A. Hamidi et G. Coquery, EFFECTS OF CURRENT-DENSITY AND CHIP TEMPERATURE DISTRIBUTION ON LIFETIME OF HIGH-POWER IGBT MODULES IN TRACTION WORKING-CONDITIONS, Microelectronics and reliability, 37(10-11), 1997, pp. 1755-1758
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