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Results: 1-4 |
Results: 4
Resist hardening by fluorocarbon plasma for electron-beam and optical mix-and-match lithography
Authors: Chan, VWC Hai, CH Chan, PCH
Citation: Vwc. Chan et al., Resist hardening by fluorocarbon plasma for electron-beam and optical mix-and-match lithography, J VAC SCI B, 19(3), 2001, pp. 743-748
Multiple layers of CMOS integrated circuits using recrystallized silicon film
Authors: Chan, VWC Chan, PCH Chan, M
Citation: Vwc. Chan et al., Multiple layers of CMOS integrated circuits using recrystallized silicon film, IEEE ELEC D, 22(2), 2001, pp. 77-79
Fabrication of gate-all-around transistors using metal induced lateral crystallization
Authors: Chan, VWC Chan, PCH
Citation: Vwc. Chan et Pch. Chan, Fabrication of gate-all-around transistors using metal induced lateral crystallization, IEEE ELEC D, 22(2), 2001, pp. 80-82
Three-dimensional CMOS SOI integrated circuit using high-temperature metal-induced lateral crystallization
Authors: Chan, VWC Chan, PCH Chan, M
Citation: Vwc. Chan et al., Three-dimensional CMOS SOI integrated circuit using high-temperature metal-induced lateral crystallization, IEEE DEVICE, 48(7), 2001, pp. 1394-1399
Risultati: 1-4 |