Authors: Dunne, RC Sitaraman, SK Luo, SJ Rao, Y Wong, CP Estes, WE Gonzalez, CG Coburn, JC Periyasamy, M

Citation: Rc. Dunne et al., Investigation of the curing behavior of a novel epoxy photo-dielectric dryfilm (ViaLux (TM) 81) for high density interconnect applications, J APPL POLY, 78(2), 2000, pp. 430-437