Citation: Dd. Shepard et al., APPLICATIONS OF DIELECTRIC ANALYSIS FOR CURE MONITORING AND CONTROL IN THE POLYESTER SMC BMC MOLDING INDUSTRY/, Journal of reinforced plastics and composites, 14(3), 1995, pp. 297-308
Citation: Dr. Day, CURE CHARACTERIZATION OF THICK SMC PARTS USING DIELECTRIC AND FINITE-DIFFERENCE ANALYSIS, Journal of reinforced plastics and composites, 13(10), 1994, pp. 918-926
Citation: Dj. Melotik et al., ANALYSIS OF THE RESIN TRANSFER MOLDING PROCESS USING IN-MOLD DIELECTRIC SENSORS, Thermochimica acta, 217, 1993, pp. 251-262