AAAAAA
Results: 26-35/35
Authors:
KANDLER E
GRASSHOFF G
DRESCHER K
Citation: E. Kandler et al., CHARACTERIZATION OF PLASMA IN AN INDUCTIVELY-COUPLED HIGH-DENSE PLASMA SOURCE, Surface & coatings technology, 74-5(1-3), 1995, pp. 539-545
Authors:
RICHTER K
DRESCHER K
Citation: K. Richter et K. Drescher, PYROMETRIC SUBSTRATE-TEMPERATURE MEASUREMENT DURING PLASMA-ETCHING, Surface & coatings technology, 74-5(1-3), 1995, pp. 546-551
Authors:
STAVREVA Z
ZEIDLER D
PLOTNER M
DRESCHER K
Citation: Z. Stavreva et al., CHEMICAL-MECHANICAL POLISHING OF COPPER FOR MULTILEVEL METALLIZATION, Applied surface science, 91(1-4), 1995, pp. 192-196
Authors:
STAVREV M
WENZEL C
MOLLER A
DRESCHER K
Citation: M. Stavrev et al., SPUTTERING OF TANTALUM-BASED DIFFUSION-BARRIERS IN SI CU METALLIZATION - EFFECTS OF GAS-PRESSURE AND COMPOSITION/, Applied surface science, 91(1-4), 1995, pp. 257-262
Authors:
VOGT M
DRESCHER K
Citation: M. Vogt et K. Drescher, BARRIER BEHAVIOR OF PLASMA-DEPOSITED SILICON-OXIDE AND NITRIDE AGAINST CU DIFFUSION, Applied surface science, 91(1-4), 1995, pp. 303-307
Authors:
DRESCHER K
BOEDEKER W
Citation: K. Drescher et W. Boedeker, ASSESSMENT OF THE COMBINED EFFECTS OF SUBSTANCES - THE RELATIONSHIP BETWEEN CONCENTRATION ADDITION AND INDEPENDENT ACTION, Biometrics, 51(2), 1995, pp. 716-730
Authors:
PREUSS A
ADOLPHI B
DRESCHER K
Citation: A. Preuss et al., OXIDATION OF IN-48SN, Journal of the Electrochemical Society, 141(10), 1994, pp. 2784-2788
Authors:
VOGT M
KANDLER E
MARTIN S
DRESCHER K
Citation: M. Vogt et al., PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION OF THIN INSULATOR FILMS ANDREACTOR CLEANING, Surface & coatings technology, 59(1-3), 1993, pp. 306-309
Authors:
SCHILL W
JOCKEL KH
DRESCHER K
TIMM J
Citation: W. Schill et al., LOGISTIC ANALYSIS IN CASE-CONTROL STUDIES UNDER VALIDATION SAMPLING, Biometrika, 80(2), 1993, pp. 339-352
Authors:
GREENLAND S
DRESCHER K
Citation: S. Greenland et K. Drescher, MAXIMUM-LIKELIHOOD-ESTIMATION OF THE ATTRIBUTABLE FRACTION FROM LOGISTIC-MODELS, Biometrics, 49(3), 1993, pp. 865-872