Authors: Dai, XS Brillhart, MV Roesch, M Ho, PS

Citation: Xs. Dai et al., Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging, IEEE T COMP, 23(1), 2000, pp. 117-127

Authors: Dai, XS Omori, H Okumura, Y Ando, M Oki, H Hashimoto, N Baba, H

Citation: Xs. Dai et al., Serial measurement of polyethylene wear of well-fixed cementless metal-backed acetabular component in total hip arthroplasty: An over 10 year follow-up study, ARTIF ORGAN, 24(9), 2000, pp. 746-751

Authors: Dai, XS Kano, N Kako, M Nakadaira, Y

Citation: Xs. Dai et al., Reactions of vinyldisilanes with ruthenium carbonyl, CHEM LETT, (8), 1999, pp. 717-718