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Results: 1-9 |
Results: 9
Evaluation of the moisture sensitivity of molding compounds of IC's packages
Authors: Fremont, H Deletage, JY Pintus, A Danto, Y
Citation: H. Fremont et al., Evaluation of the moisture sensitivity of molding compounds of IC's packages, J ELEC PACK, 123(1), 2001, pp. 16-18
Experimental procedure for the evaluation of GaAs-based HBT's reliability
Authors: Maneux, C Labat, N Malbert, N Touboul, A Danto, Y Dumas, JM Riet, M Benchimol, JL
Citation: C. Maneux et al., Experimental procedure for the evaluation of GaAs-based HBT's reliability, MICROELEC J, 32(4), 2001, pp. 357-371
Microelectronic packaging and assembling
Authors: Danto, Y Lall, P Tay, AAO
Citation: Y. Danto et al., Microelectronic packaging and assembling, MICROEL REL, 40(7), 2000, pp. 1069-1071
Reliability evaluation of adhesive bonded SMT components in industrial applications
Authors: Perichaud, MG Deletage, JY Fremont, H Danto, Y Faure, C
Citation: Mg. Perichaud et al., Reliability evaluation of adhesive bonded SMT components in industrial applications, MICROEL REL, 40(7), 2000, pp. 1227-1234
1/f noise as a diagnostic tool to investigate the quality of isotropic conductive adhesive bonds
Authors: Vandamme, LKJ Perichaud, MG Noguera, E Danto, Y Behner, U
Citation: Lkj. Vandamme et al., 1/f noise as a diagnostic tool to investigate the quality of isotropic conductive adhesive bonds, IEEE T COMP, 22(3), 1999, pp. 446-454
2D physical simulation of degradation on transistors induced by FIB exposure of dielectric passivation
Authors: Benbrik, J Rolland, G Meunier, D Benteo, B Labat, N Maneux, C Danto, Y
Citation: J. Benbrik et al., 2D physical simulation of degradation on transistors induced by FIB exposure of dielectric passivation, MICROEL REL, 39(6-7), 1999, pp. 1027-1031
Effects of RF life-test on LF electrical parameters of GaAs power MESFETs
Authors: Saysset-Malbert, N Lambert, B Maneux, C Labat, N Touboul, A Danto, Y Vandamme, LKJ Huguet, P Auxemery, P Garat, F
Citation: N. Saysset-malbert et al., Effects of RF life-test on LF electrical parameters of GaAs power MESFETs, MICROEL REL, 39(6-7), 1999, pp. 1061-1066
1/f Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment
Authors: Vandamme, LKJ Perichaud, MG Noguera, E Danto, Y Behner, U
Citation: Lkj. Vandamme et al., 1/f Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment, MICROEL REL, 39(6-7), 1999, pp. 1089-1094
Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy
Authors: Bechou, L Angrisiani, L Ousten, Y Dallet, D Levi, H Daponte, P Danto, Y
Citation: L. Bechou et al., Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy, MICROEL REL, 39(6-7), 1999, pp. 1095-1101
Risultati: 1-9 |