Authors: Yin, KM Chang, L Chen, FR Kai, JJ Chiang, CC Ding, PJ Chin, B Zhang, H Chen, FS

Citation: Km. Yin et al., The effect of oxygen in the annealing ambient on interfacial reactions of Cu/Ta/Si multilayers, THIN SOL FI, 388(1-2), 2001, pp. 15-21

Authors: Yin, KM Chang, L Chen, FR Kai, JJ Chiang, CC Chuang, G Ding, PJ Chin, B Zhang, H Chen, FS

Citation: Km. Yin et al., Oxidation of Ta diffusion barrier layer for Cu metallization in thermal annealing, THIN SOL FI, 388(1-2), 2001, pp. 27-33

Authors: Fu, JM Ding, PJ Dorleans, F Xu, Z Chen, FS

Citation: Jm. Fu et al., Deposition of copper by using self-sputtering, J VAC SCI A, 17(5), 1999, pp. 2830-2834