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Results:
1-21
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Results: 21
Authors:
Young, CC
Duh, JG
Tsai, SY
Citation: Cc. Young et al., Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3 substrate, J ELEC MAT, 30(9), 2001, pp. 1241-1248
Authors:
Young, BL
Duh, JG
Citation: Bl. Young et Jg. Duh, Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn58Bi solder during annealing, J ELEC MAT, 30(7), 2001, pp. 878-884
Authors:
Young, BL
Duh, JG
Chiou, BS
Citation: Bl. Young et al., Wettability of electroless Ni in the under bump metallurgy with lead free solder, J ELEC MAT, 30(5), 2001, pp. 543-553
Authors:
Tsai, YY
Wu, FB
Chen, YI
Peng, PJ
Duh, JG
Tsai, SY
Citation: Yy. Tsai et al., Thermal stability and mechanical properties of Ni-W-P electroless deposits, SURF COAT, 146, 2001, pp. 502-507
Authors:
Young, CC
Duh, JG
Huang, CS
Citation: Cc. Young et al., Improved characteristics of electroless Cu deposition on Pt-Ag metallized Al2O3 substrates in microelectronics packaging, SURF COAT, 145(1-3), 2001, pp. 215-225
Authors:
Chang, YC
Duh, JG
Chen, YI
Citation: Yc. Chang et al., Fabrication and crystallization behaviors of sputtered Ni-Cu-P films on tool steel, SURF COAT, 139(2-3), 2001, pp. 233-243
Authors:
Chen, JS
Duh, JG
Citation: Js. Chen et Jg. Duh, Indentation behavior and Young's modulus evaluation in electroless Ni modified CrN coating on mild steel, SURF COAT, 139(1), 2001, pp. 6-13
Authors:
Miao, HW
Duh, JG
Citation: Hw. Miao et Jg. Duh, Microstructure evolution in Sn-Bi and Sn-Bi-Cu solder joints under thermalaging, MATER CH PH, 71(3), 2001, pp. 255-271
Authors:
Lo, CL
Duh, JG
Chiou, BS
Peng, CC
Ozawa, L
Citation: Cl. Lo et al., Synthesis of Eu3+-activated yttrium oxysulfide red phosphor by flux fusionmethod, MATER CH PH, 71(2), 2001, pp. 179-189
Authors:
Lin, JD
Duh, JG
Chiou, BS
Citation: Jd. Lin et al., The influence of washing and calcination condition on urea-derived ceria-yttria-doped tetragonal zirconia powders, MATER CH PH, 68(1-3), 2001, pp. 42-55
Authors:
Chen, YY
Duh, JG
Chiou, BS
Peng, CG
Citation: Yy. Chen et al., Luminescent mechanisms of ZnS : Cu : Cl and ZnS : Cu : Al phosphors, THIN SOL FI, 392(1), 2001, pp. 50-55
Authors:
Lin, TY
Duh, JG
Chung, CK
Niu, H
Citation: Ty. Lin et al., Fabrication of low-stress plasma enhanced chemical vapor deposition silicon carbide films, JPN J A P 1, 39(12A), 2000, pp. 6663-6671
Authors:
Miao, HW
Duh, JG
Chiou, BS
Citation: Hw. Miao et al., Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints, J MAT S-M E, 11(8), 2000, pp. 609-618
Authors:
Chen, YY
Duh, JG
Chiou, BS
Citation: Yy. Chen et al., The effect of substrate surface roughness on the wettability of Sn-Bi solders, J MAT S-M E, 11(4), 2000, pp. 279-283
Authors:
Tu, JN
Duh, JG
Tsai, SY
Citation: Jn. Tu et al., Morphology, mechanical properties, and oxidation behavior of reactively sputtered Cr-N films, SURF COAT, 133, 2000, pp. 181-185
Authors:
Wu, FB
Li, JJ
Duh, JG
Citation: Fb. Wu et al., Evaluation of the mechanical properties and tribological behavior of the CrN coating deposited on mild steel modified with electroless Ni interlayer, THIN SOL FI, 377, 2000, pp. 354-359
Authors:
Lee, YG
Duh, JG
Citation: Yg. Lee et Jg. Duh, Phase analysis in the solder joint of Sn-Cu solder/IMCs/Cu substrate, MATER CHAR, 42(2-3), 1999, pp. 143-160
Authors:
Lee, YG
Duh, JG
Citation: Yg. Lee et Jg. Duh, Interfacial morphology and concentration profile in the unleaded solder/Cujoint assembly, J MAT S-M E, 10(1), 1999, pp. 33-43
Authors:
Wei, YY
Duh, JG
Citation: Yy. Wei et Jg. Duh, Effect of thermal ageing on (Sn-Ag, Sn-Ag-Zn)/PtAg, Cu/Al2O3 solder joints, J MAT S-M E, 9(5), 1998, pp. 373-381
Authors:
Tan, TR
Cheng, JR
Wang, JH
Duh, JG
Shih, HC
Citation: Tr. Tan et al., Morphology and characterization of the anodic coating on galvanized steelsprepared by alternating currents, SURF COAT, 110(3), 1998, pp. 194-199
Authors:
Lee, YG
Duh, JG
Citation: Yg. Lee et Jg. Duh, Characterizing the formation and growth of intermetallic compound in the solder joint, J MATER SCI, 33(23), 1998, pp. 5569-5572
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1-21
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