Authors:
Dunne, RC
Sitaraman, SK
Luo, SJ
Wong, CP
Estes, WE
Periyasamy, M
Coburn, J
Citation: Rc. Dunne et al., Thermal and mechanical characterization of ViaLuX (TM) 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications, IEEE T COMP, 24(3), 2001, pp. 436-444
Citation: Kl. Rees et al., Gold process modelling. II. The effect of ore type on leaching and adsorption dynamics at Telfer gold mine, MINER ENG, 14(8), 2001, pp. 887-900
Authors:
Dunne, RC
Sitaraman, SK
Luo, SJ
Rao, Y
Wong, CP
Estes, WE
Gonzalez, CG
Coburn, JC
Periyasamy, M
Citation: Rc. Dunne et al., Investigation of the curing behavior of a novel epoxy photo-dielectric dryfilm (ViaLux (TM) 81) for high density interconnect applications, J APPL POLY, 78(2), 2000, pp. 430-437