Authors: MA JB DRAGON J VANDERVEER W ENTENBERG A LINDBERG V ANSCHEL M SHIH DY LAURO P

Citation: Jb. Ma et al., USE OF HIGH-TEMPERATURE AND HIGH HUMIDITY TO TEST THE ADHESION OF SPUTTERED COPPER TO A POLYIMIDE SURFACE-MODIFIED BY AN AC NITROGEN GLOW-DISCHARGE, Journal of adhesion science and technology, 9(4), 1995, pp. 487-499