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Results: 1-2 |
Results: 2
Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications
Authors: Eisenbraun, E Upham, A Dash, R Zeng, WX Hoefnagels, J Lane, S Anjum, D Dovidenko, K Kaloyeros, A Arkles, B Sullivan, JJ
Citation: E. Eisenbraun et al., Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications, J VAC SCI B, 18(4), 2000, pp. 2011-2015
Ultrathin diffusion barriers/liners for gigascale copper metallization
Authors: Kaloyeros, AE Eisenbraun, E
Citation: Ae. Kaloyeros et E. Eisenbraun, Ultrathin diffusion barriers/liners for gigascale copper metallization, ANN R MATER, 30, 2000, pp. 363-385
Risultati: 1-2 |