Authors: Dunne, RC Sitaraman, SK Luo, SJ Wong, CP Estes, WE Periyasamy, M Coburn, J

Citation: Rc. Dunne et al., Thermal and mechanical characterization of ViaLuX (TM) 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications, IEEE T COMP, 24(3), 2001, pp. 436-444

Authors: Dunne, RC Sitaraman, SK Luo, SJ Rao, Y Wong, CP Estes, WE Gonzalez, CG Coburn, JC Periyasamy, M

Citation: Rc. Dunne et al., Investigation of the curing behavior of a novel epoxy photo-dielectric dryfilm (ViaLux (TM) 81) for high density interconnect applications, J APPL POLY, 78(2), 2000, pp. 430-437