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Results:
1-4
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Results: 4
Integrating system and feature scale models to study copper reflow
Authors:
Friedrich, LJ Dew, SK Brett, MJ Smy, T
Citation:
Lj. Friedrich et al., Integrating system and feature scale models to study copper reflow, J VAC SCI B, 17(1), 1999, pp. 186-193
A simulation study of copper reflow characteristics in vias
Authors:
Friedrich, LJ Dew, SK Brett, MJ Smy, T
Citation:
Lj. Friedrich et al., A simulation study of copper reflow characteristics in vias, IEEE SEMIC, 12(3), 1999, pp. 353-365
Self-shadowing and surface diffusion effects in obliquely deposited thin films (vol 339, pg 88, 1999)
Authors:
Vick, D Friedrich, LJ Dew, SK Brett, MJ Robbie, K Seto, M Smy, T
Citation:
D. Vick et al., Self-shadowing and surface diffusion effects in obliquely deposited thin films (vol 339, pg 88, 1999), THIN SOL FI, 349(1-2), 1999, pp. 303-303
Self-shadowing and surface diffusion effects in obliquely deposited thin films
Authors:
Vick, D Friedrich, LJ Dew, SK Brett, MJ Robbie, K Seto, M Smy, T
Citation:
D. Vick et al., Self-shadowing and surface diffusion effects in obliquely deposited thin films, THIN SOL FI, 339(1-2), 1999, pp. 88-94
Risultati:
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