Authors:
Donaton, RA
Coenegrachts, B
Maenhoudt, M
Pollentier, I
Struyf, H
Vanhaelemeersch, S
Vos, I
Meuris, M
Fyen, W
Beyer, G
Tokei, Z
Stucchi, M
Vervoort, I
De Roest, D
Maex, K
Citation: Ra. Donaton et al., Integration of Cu and low-k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures, MICROEL ENG, 55(1-4), 2001, pp. 277-283
Authors:
Vos, R
Lux, M
Xu, K
Fyen, W
Kenens, C
Conard, T
Mertens, P
Heyns, M
Hatcher, Z
Hoffman, M
Citation: R. Vos et al., Removal of submicrometer particles from silicon wafer surfaces using HF-based cleaning mixtures, J ELCHEM SO, 148(12), 2001, pp. G683-G691