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Results: 1
UNDERFLOW PROCESS FOR DIRECT-CHIP-ATTACHMENT PACKAGING
Authors:
LEHMANN GL DRISCOLL T GUYDOSH NR LI PC COTTS EJ
Citation:
Gl. Lehmann et al., UNDERFLOW PROCESS FOR DIRECT-CHIP-ATTACHMENT PACKAGING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 266-274
Risultati:
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