Authors: Tsionsky, V Gileadi, E

Citation: V. Tsionsky et E. Gileadi, Early stages in the electroplating of copper and silver on gold, MAT SCI E A, 302(1), 2001, pp. 120-127

Authors: Inberg, A Zhu, L Hirschberg, G Gladkikh, A Croitoru, N Shacham-Diamand, Y Gileadi, E

Citation: A. Inberg et al., Characterization of the initial growth stages of electroless Ag(W) films deposited on Si(100), J ELCHEM SO, 148(12), 2001, pp. C784-C789

Authors: Younes, O Gileadi, E

Citation: O. Younes et E. Gileadi, Electroplating of high tungsten content Ni/W alloys, EL SOLID ST, 3(12), 2000, pp. 543-545

Authors: Daikhin, L Gileadi, E Tsionsky, V Urbakh, M Zilberman, G

Citation: L. Daikhin et al., Slippage at adsorbate-electrolyte interface. Response of electrochemical quartz crystal microbalance to adsorption, ELECTR ACT, 45(22-23), 2000, pp. 3615-3621

Authors: Zilberman, G Tsionsky, V Gileadi, E

Citation: G. Zilberman et al., Solvent structure at the metal/solution interface and the response of the EQCM, ELECTR ACT, 45(21), 2000, pp. 3473-3482

Authors: Gileadi, E Tsionsky, V

Citation: E. Gileadi et V. Tsionsky, Studies of electroplating using an EQCM - I. Copper and silver on gold, J ELCHEM SO, 147(2), 2000, pp. 567-574