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Results: 1-19 |
Results: 19
Interactions between silica xerogel and tantalum
Authors: Rogojevic, S Jain, A Wang, F Gill, WN Wayner, PC Plawsky, JL Lu, TM Yang, GR Lanford, WA Kumar, A Bakhru, H Roy, AN
Citation: S. Rogojevic et al., Interactions between silica xerogel and tantalum, J VAC SCI B, 19(2), 2001, pp. 354-360
Chemical-mechanical polishing of SiOC organosilicate glasses: the effect of film carbon content
Authors: Borst, CL Korthuis, V Shinn, GB Luttmer, JD Gutmann, RJ Gill, WN
Citation: Cl. Borst et al., Chemical-mechanical polishing of SiOC organosilicate glasses: the effect of film carbon content, THIN SOL FI, 385(1-2), 2001, pp. 281-292
Thermal redistribution reactions of Blackglas (TM) ceramic
Authors: Wang, F Apple, T Gill, WN
Citation: F. Wang et al., Thermal redistribution reactions of Blackglas (TM) ceramic, J APPL POLY, 81(1), 2001, pp. 143-152
Effects of processing history on the modulus of silica xerogel films
Authors: Jain, A Rogojevic, S Gill, WN Plawsky, JL Matthew, I Tomozawa, M Simonyi, E
Citation: A. Jain et al., Effects of processing history on the modulus of silica xerogel films, J APPL PHYS, 90(11), 2001, pp. 5832-5834
Three-dimensional chemical mechanical planarization slurry flow model based on lubrication theory
Authors: Thakurta, DG Borst, CL Schwendeman, DW Gutmann, RJ Gill, WN
Citation: Dg. Thakurta et al., Three-dimensional chemical mechanical planarization slurry flow model based on lubrication theory, J ELCHEM SO, 148(4), 2001, pp. G207-G214
Mass transfer models for the electrodeposition of copper with a buffering agent
Authors: Gill, WN Duquette, DJ Varadarajan, D
Citation: Wn. Gill et al., Mass transfer models for the electrodeposition of copper with a buffering agent, J ELCHEM SO, 148(4), 2001, pp. C289-C296
Etching of xerogel in high-density fluorocarbon plasmas
Authors: Standaert, TEFM Joseph, EA Oehrlein, GS Jain, A Gill, WN Wayner, PC Plawsky, JL
Citation: Tefm. Standaert et al., Etching of xerogel in high-density fluorocarbon plasmas, J VAC SCI A, 18(6), 2000, pp. 2742-2748
A new feature scale modem, and experiments of the hydrogen plasma assistedchemical vapor deposition of copper
Authors: Lakshmanan, SK Gill, WN
Citation: Sk. Lakshmanan et Wn. Gill, A new feature scale modem, and experiments of the hydrogen plasma assistedchemical vapor deposition of copper, CHEM ENG CO, 182, 2000, pp. 99-119
Pad porosity, compressibility and slurry delivery effects in chemical-mechanical planarization: modeling and experiments
Authors: Thakurta, DG Borst, CL Schwendeman, DW Gutmann, RJ Gill, WN
Citation: Dg. Thakurta et al., Pad porosity, compressibility and slurry delivery effects in chemical-mechanical planarization: modeling and experiments, THIN SOL FI, 366(1-2), 2000, pp. 181-190
NMR characterization of postcure temperature effects on the microstructures of Blackglas (TM) resin and ceramic
Authors: Wang, F Gill, WN Kirk, CA Apple, T
Citation: F. Wang et al., NMR characterization of postcure temperature effects on the microstructures of Blackglas (TM) resin and ceramic, J NON-CRYST, 275(3), 2000, pp. 210-215
A tertiary current distribution model for the pulse plating of copper intohigh aspect ratio sub-0.25 mu m trenches
Authors: Varadarajan, D Lee, CY Krishnamoorthy, A Duquette, DJ Gill, WN
Citation: D. Varadarajan et al., A tertiary current distribution model for the pulse plating of copper intohigh aspect ratio sub-0.25 mu m trenches, J ELCHEM SO, 147(9), 2000, pp. 3382-3392
Thermal conductivity study of porous low-k dielectric materials
Authors: Hu, C Morgen, M Ho, PS Jain, A Gill, WN Plawsky, JL Wayner, PC
Citation: C. Hu et al., Thermal conductivity study of porous low-k dielectric materials, APPL PHYS L, 77(1), 2000, pp. 145-147
Surface modified spin-on xerogel films as interlayer dielectrics
Authors: Nitta, SV Pisupatti, V Jain, A Wayner, PC Gill, WN Plawsky, JL
Citation: Sv. Nitta et al., Surface modified spin-on xerogel films as interlayer dielectrics, J VAC SCI B, 17(1), 1999, pp. 205-212
Modeling vapor deposition of low-K polymers: Parylene and polynaphthalene
Authors: Rogojevic, S Moore, JA Gill, WN
Citation: S. Rogojevic et al., Modeling vapor deposition of low-K polymers: Parylene and polynaphthalene, J VAC SCI A, 17(1), 1999, pp. 266-274
A novel model of hydrogen plasma assisted chemical vapor deposition of copper
Authors: Lakshmanan, SK Gill, WN
Citation: Sk. Lakshmanan et Wn. Gill, A novel model of hydrogen plasma assisted chemical vapor deposition of copper, THIN SOL FI, 338(1-2), 1999, pp. 24-39
Effect of sol rheology on the uniformity of spin-on silica xerogel films
Authors: Nitta, SV Jain, A Wayner, PC Gill, WN Plawsky, JL
Citation: Sv. Nitta et al., Effect of sol rheology on the uniformity of spin-on silica xerogel films, J APPL PHYS, 86(10), 1999, pp. 5870-5878
Low temperature transport of Al into and through copper starting with Cu/Al/SiO2 bilayers
Authors: Lanford, WA Bedell, S Isberg, P Hjorvarsson, B Lakshmanan, SK Gill, WN
Citation: Wa. Lanford et al., Low temperature transport of Al into and through copper starting with Cu/Al/SiO2 bilayers, J APPL PHYS, 85(3), 1999, pp. 1487-1495
Two-dimensional wafer-scale chemical mechanical planarization models basedon lubrication theory and mass transport
Authors: Sundararajan, S Thakurta, DG Schwendeman, DW Murarka, SP Gill, WN
Citation: S. Sundararajan et al., Two-dimensional wafer-scale chemical mechanical planarization models basedon lubrication theory and mass transport, J ELCHEM SO, 146(2), 1999, pp. 761-766
Chemical mechanical polishing mechanisms of low dielectric constant polymers in copper slurries
Authors: Borst, CL Thakurta, DG Gill, WN Gutmann, RJ
Citation: Cl. Borst et al., Chemical mechanical polishing mechanisms of low dielectric constant polymers in copper slurries, J ELCHEM SO, 146(11), 1999, pp. 4309-4315
Risultati: 1-19 |