Authors: Barut, A Guven, I Madenci, E

Citation: A. Barut et al., Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading, INT J SOL S, 38(50-51), 2001, pp. 9077-9109

Authors: Anderson, T Guven, I Madenci, E Gustafsson, G

Citation: T. Anderson et al., The necessity of reexamining previous life prediction analyses of solder joints in electronic packages, IEEE T COMP, 23(3), 2000, pp. 516-520

Authors: Sburlati, R Madenci, E Guven, I

Citation: R. Sburlati et al., Local buckling of a circular interface delamination between a layer and a substrate with finite thickness, J APPL MECH, 67(3), 2000, pp. 590-596

Authors: Guven, I Chan, CL Madenci, E

Citation: I. Guven et al., Transient two-dimensional thermal analysis of electronic packages by the boundary element method, IEEE T AD P, 22(3), 1999, pp. 476-486