Authors:
Venkatraman, R
Ramakrishna, K
Knadle, K
Chen, WT
Haddon, GC
Citation: R. Venkatraman et al., Evaluation of smear and its effect on the mechanical integrity of plated through hole-inner plane interface in thick printed wiring boards, J ELEC PACK, 123(1), 2001, pp. 6-15