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Results: 1-3 |
Results: 3
Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography
Authors: McNally, PJ Rantamaki, R Tuomi, T Danilewsky, AN Lowney, D Curley, JW Herbert, PAF
Citation: Pj. Mcnally et al., Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography, IEEE T COMP, 24(1), 2001, pp. 76-83
Use of plasma impedance monitoring for the determination of SF6 reactive ion etch process end points in a SiO2/Si system
Authors: Dewan, MNA McNally, PJ Perova, T Herbert, PAF
Citation: Mna. Dewan et al., Use of plasma impedance monitoring for the determination of SF6 reactive ion etch process end points in a SiO2/Si system, MAT RES INN, 5(2), 2001, pp. 107-116
Examination of the structural and optical failure of ultra-bright LEDs under varying degrees of electrical stress using synchrotron X-ray topography and optical emission spectroscopy
Authors: Lowney, D McNally, PJ O'Hare, M Herbert, PAF Tuomi, T Rantamaki, R Karilahti, M Danilewsky, AN
Citation: D. Lowney et al., Examination of the structural and optical failure of ultra-bright LEDs under varying degrees of electrical stress using synchrotron X-ray topography and optical emission spectroscopy, J MAT S-M E, 12(4-6), 2001, pp. 249-253
Risultati: 1-3 |