Authors: Eisenbraun, E Upham, A Dash, R Zeng, WX Hoefnagels, J Lane, S Anjum, D Dovidenko, K Kaloyeros, A Arkles, B Sullivan, JJ

Citation: E. Eisenbraun et al., Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications, J VAC SCI B, 18(4), 2000, pp. 2011-2015