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Results:
1-9
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Results: 9
Authors:
Hsieh, JH
Zhang, WH
Li, C
Sun, CQ
Citation: Jh. Hsieh et al., Characterization of (Ti-x Cr0.6-x)N-0.4 coatings and their tribological behaviors against an epoxy molding compound, SURF COAT, 146, 2001, pp. 331-337
Authors:
Lin, TC
Chang, FH
Hsieh, JH
Chao, HR
Chao, MR
Citation: Tc. Lin et al., Environmental exposure to polycyclic aromatic hydrocarbons and total suspended particulates in a Taiwanese temple, B ENVIR CON, 67(3), 2001, pp. 332-338
Authors:
Tsai, CL
Yang, YF
Han, CC
Hsieh, JH
Chang, M
Citation: Cl. Tsai et al., Measurement and simulation of light distribution in biological tissues, APPL OPTICS, 40(31), 2001, pp. 5770-5777
Authors:
Hsieh, JH
Chen, YS
Han, YY
Hsieh, CH
Chang, CI
Ko, WJ
Citation: Jh. Hsieh et al., Use of extracorporeal membrane oxygenation to rescue a child with acute respiratory distress syndrome, J FORMOS ME, 99(3), 2000, pp. 257-260
Authors:
Zhang, WH
Hsieh, JH
Citation: Wh. Zhang et Jh. Hsieh, Tribological behavior of TiN and CrN coatings sliding against an epoxy molding compound, SURF COAT, 130(2-3), 2000, pp. 240-247
Authors:
Yi, S
Kim, JK
Yue, CY
Hsieh, JH
Citation: S. Yi et al., Bonding strengths at plastic encapsulant-gold-plated copper leadframe interface, MICROEL REL, 40(7), 2000, pp. 1207-1214
Authors:
Yi, S
Kim, JK
Yue, CY
Hsieh, JH
Citation: S. Yi et al., Adhesion strengths of epoxy molding compounds to gold-plated copper leadframes, J ADHESION, 73(1), 2000, pp. 1
Authors:
Hsieh, JH
Fong, LH
Yi, S
Metha, G
Citation: Jh. Hsieh et al., Plasma cleaning of copper leadframe with Ar and Ar/H-2 gases, SURF COAT, 112(1-3), 1999, pp. 245-249
Authors:
Yi, S
Yue, CY
Hsieh, JH
Fong, LH
Lahiri, SK
Citation: S. Yi et al., Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes, J ADHES SCI, 13(7), 1999, pp. 789-804
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