Authors: Filippi, RG Gribelyuk, MA Joseph, T Kane, T Sullivan, TD Clevenger, LA Costrini, G Gambino, J Iggulden, RC Kiewra, EW Ning, XJ Ravikumar, R Schnabel, RF Stojakovic, G Weber, SJ Gignac, LM Hu, CK Rath, DL Rodbell, KP

Citation: Rg. Filippi et al., Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching, THIN SOL FI, 388(1-2), 2001, pp. 303-314

Authors: Schnabel, RF Clevenger, LA Costrini, G Dobuzinsky, DM Filippi, R Gambino, J Lee, GY Iggulden, RC Lin, C Lu, ZG Ning, XJ Ramachandran, R Ronay, M Tobben, D Weber, SJ

Citation: Rf. Schnabel et al., Aluminum dual damascene metallization for 0.175 mu m DRAM generations and beyond - (invited), MICROEL ENG, 50(1-4), 2000, pp. 265-270

Authors: Rodbell, KP Gignac, LM Hurd, JL Filippi, R Wang, YY Clevenger, LA Iggulden, RC Schnabel, RF Weber, S

Citation: Kp. Rodbell et al., The microstructure of submicrometer wide planar-reactive ion etched versustrench-damascene AlCu lines, J APPL PHYS, 88(9), 2000, pp. 5093-5099