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Results: 1-8 |
Results: 8
ELECTROMIGRATION FAILURE MODEL - ITS APPLICATION TO W PLUG AND AL-FILLED VIAS
Authors: KAWASAKI H GALL M JAWARANI D HERNANDEZ R CAPASSO C
Citation: H. Kawasaki et al., ELECTROMIGRATION FAILURE MODEL - ITS APPLICATION TO W PLUG AND AL-FILLED VIAS, Thin solid films, 320(1), 1998, pp. 45-51
VOID-FREE CHEMICALLY VAPOR-DEPOSITED ALUMINUM DUAL INLAID METALLIZATION SCHEMES FOR ULTRA-LARGE-SCALE-INTEGRATED VIA AND INTERCONNECT APPLICATIONS
Authors: ONG TP FIORDALICE R VENKATRAMAN R GARCIA S JAIN A SPARKS T FARKAS J FERNANDES M GALL M JAWARANI D KLEIN J WEITZMAN E KAWASAKI H WU W BLUMENTHAL R PINTCHOVSKI F MARSH R ZHANG P ZHANG H GUO T MOSELY R
Citation: Tp. Ong et al., VOID-FREE CHEMICALLY VAPOR-DEPOSITED ALUMINUM DUAL INLAID METALLIZATION SCHEMES FOR ULTRA-LARGE-SCALE-INTEGRATED VIA AND INTERCONNECT APPLICATIONS, Applied physics letters, 73(1), 1998, pp. 82-84
IN-SITU TRANSMISSION ELECTRON-MICROSCOPY STUDY OF PLASTIC-DEFORMATIONAND STRESS-INDUCED VOIDING IN AL-CU INTERCONNECTS
Authors: JAWARANI D KAWASAKI H YEO IS RABENBERG L STARK JP HO PS
Citation: D. Jawarani et al., IN-SITU TRANSMISSION ELECTRON-MICROSCOPY STUDY OF PLASTIC-DEFORMATIONAND STRESS-INDUCED VOIDING IN AL-CU INTERCONNECTS, Journal of applied physics, 82(4), 1997, pp. 1563-1577
IN-SITU TRANSMISSION ELECTRON-MICROSCOPY STUDY OF PLASTIC-DEFORMATIONIN PASSIVATED AL-CU THIN-FILMS
Authors: JAWARANI D KAWASAKI H YEO IS RABENBERG L STARK JP HO PS
Citation: D. Jawarani et al., IN-SITU TRANSMISSION ELECTRON-MICROSCOPY STUDY OF PLASTIC-DEFORMATIONIN PASSIVATED AL-CU THIN-FILMS, Journal of applied physics, 82(1), 1997, pp. 171-181
EFFECTS OF OXIDE OVERLAYER ON THERMAL-STRESS AND YIELD BEHAVIOR OF AL-ALLOY FILMS
Authors: YEO IS ANDERSON SGH JAWARANI D HO PS CLARKE AP SAIMOTO S RAMASWAMI S CHEUNG R
Citation: Is. Yeo et al., EFFECTS OF OXIDE OVERLAYER ON THERMAL-STRESS AND YIELD BEHAVIOR OF AL-ALLOY FILMS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 1996, pp. 2636-2644
INTERMETALLIC COMPOUND FORMATION IN TI AL ALLOY THIN-FILM COUPLES ANDITS ROLE IN ELECTROMIGRATION LIFETIME/
Authors: JAWARANI D STARK JP KAWASAKI H OLOWOLAFE JO LEE CC KLEIN J PINTCHOVSKI F
Citation: D. Jawarani et al., INTERMETALLIC COMPOUND FORMATION IN TI AL ALLOY THIN-FILM COUPLES ANDITS ROLE IN ELECTROMIGRATION LIFETIME/, Journal of the Electrochemical Society, 141(1), 1994, pp. 302-306
CRITICAL DISCUSSION OF RELEVANT PHYSICAL ISSUES SURROUNDING THE WEEPING OF NUCLEAR-WASTE CASKS
Authors: JAWARANI D STARK JP NICHOLS SP
Citation: D. Jawarani et al., CRITICAL DISCUSSION OF RELEVANT PHYSICAL ISSUES SURROUNDING THE WEEPING OF NUCLEAR-WASTE CASKS, Journal of nuclear materials, 206(1), 1993, pp. 57-67
EFFECT OF INTERFACE LAYER ON THE MICROSTRUCTURE AND ELECTROMIGRATION RESISTANCE OF AL-SI-CU ALLOY ON TIN TI SUBSTRATES/
Authors: OLOWOLAFE JO KAWASAKI H LEE CC KLEIN J PINTCHOVSKI F JAWARANI D
Citation: Jo. Olowolafe et al., EFFECT OF INTERFACE LAYER ON THE MICROSTRUCTURE AND ELECTROMIGRATION RESISTANCE OF AL-SI-CU ALLOY ON TIN TI SUBSTRATES/, Applied physics letters, 62(19), 1993, pp. 2443-2445
Risultati: 1-8 |