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TIW(N) AS DIFFUSION-BARRIERS BETWEEN CU AND SI
Authors: CHIOU JC JUANG KC CHEN MC
Citation: Jc. Chiou et al., TIW(N) AS DIFFUSION-BARRIERS BETWEEN CU AND SI, Journal of the Electrochemical Society, 142(7), 1995, pp. 2326-2331
THE PROCESSING WINDOWS FOR SELECTIVE COPPER CHEMICAL-VAPOR-DEPOSITIONFROM CU(HEXAFLUOROACETYLACETONATE)TRIMETHYLVINYLSILANE
Authors: CHIOU JC JUANG KC CHEN MC
Citation: Jc. Chiou et al., THE PROCESSING WINDOWS FOR SELECTIVE COPPER CHEMICAL-VAPOR-DEPOSITIONFROM CU(HEXAFLUOROACETYLACETONATE)TRIMETHYLVINYLSILANE, Journal of the Electrochemical Society, 142(1), 1995, pp. 177-182
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