Authors: SCHAEFER TM KACINES JJ RANDALL BA ROSZEL LE FOKKEN GJ WALTER D SCHWAB DJ MOWATT L GILBERT BK

Citation: Tm. Schaefer et al., A CHIPS-FIRST MULTICHIP-MODULE IMPLEMENTATION OF PASSIVE AND ACTIVE TEST COUPONS UTILIZING TEXAS-INSTRUMENTS HIGH-DENSITY INTERCONNECT TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(2), 1996, pp. 403-416