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Citation: Cg. Kallingal et al., AN INVESTIGATION OF SLURRY CHEMISTRY USED IN CHEMICAL-MECHANICAL PLANARIZATION OF ALUMINUM, Journal of the Electrochemical Society, 145(6), 1998, pp. 2074-2081

Authors: KALLINGAL CG TOMOZAWA M MURARKA SP

Citation: Cg. Kallingal et al., SUBSTRATE EFFECTS ON HARDNESS AND POLISHING OF SIO2 THIN-FILMS, Journal of the Electrochemical Society, 145(5), 1998, pp. 1790-1794

Authors: RAJAN K NAEEM M KALLINGAL CG

Citation: K. Rajan et al., EFFECT OF PLASMA PROCESSING ON THE MORPHOLOGICAL EVOLUTION OF THIN-FILMS, Chemical engineering communications, 153, 1996, pp. 221-229

Authors: KALLINGAL CG SMITH TR NEMEC C STOLOFF NS RAJAN K

Citation: Cg. Kallingal et al., FATIGUE DAMAGE ACCUMULATION IN NI3AL AND NIAL, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 193, 1995, pp. 502-510

Authors: KALLINGAL CG SMITH TR STOLOFF NS RAJAN K

Citation: Cg. Kallingal et al., DISLOCATION SUBSTRUCTURE IN NIAL SINGLE-CRYSTALS CYCLICALLY DEFORMED AT AMBIENT-TEMPERATURE, Acta metallurgica et materialia, 42(11), 1994, pp. 3731-3740