Authors: LI J KAO I PRASAD V

Citation: J. Li et al., MODELING STRESSES OF CONTACTS IN WIRE SAW SLICING OF POLYCRYSTALLINE AND CRYSTALLINE INGOTS - APPLICATION TO SILICON-WAFER PRODUCTION, Journal of electronic packaging, 120(2), 1998, pp. 123-128

Authors: WEI S WU S KAO I CHIANG FP

Citation: S. Wei et al., MEASUREMENT OF WAFER SURFACE USING SHADOW MOIRE TECHNIQUE WITH TALBOTEFFECT, Journal of electronic packaging, 120(2), 1998, pp. 166-170

Authors: SAHOO RK PRASAD V KAO I TALBOTT J GUPTA KP

Citation: Rk. Sahoo et al., TOWARDS AN INTEGRATED APPROACH FOR ANALYSIS AND DESIGN OF WAFER SLICING BY A WIRE SAW, Journal of electronic packaging, 120(1), 1998, pp. 35-40

Authors: KAO I CUTKOSKY MR JOHANSSON RS

Citation: I. Kao et al., ROBOTIC STIFFNESS CONTROL AND CALIBRATION AS APPLIED TO HUMAN GRASPING TASKS, IEEE transactions on robotics and automation, 13(4), 1997, pp. 557-566

Authors: KAO I GONG CH

Citation: I. Kao et Ch. Gong, ROBOT-BASED COMPUTER-INTEGRATED MANUFACTURING AS APPLIED IN MANUFACTURING AUTOMATION, Robotics and computer-integrated manufacturing, 13(2), 1997, pp. 157-167

Authors: KAO I CUTKOSKY MR

Citation: I. Kao et Mr. Cutkosky, COMPARISON OF THEORETICAL AND EXPERIMENTAL FORCE MOTION TRAJECTORIES FOR DEXTEROUS MANIPULATION WITH SLIDING/, The International journal of robotics research, 12(6), 1993, pp. 529-534