Authors:
REINIKAINEN T
POECH M
KRUMM M
KIVILAHTI J
Citation: T. Reinikainen et al., A FINITE-ELEMENT AND EXPERIMENTAL-ANALYSIS OF STRESS-DISTRIBUTION IN VARIOUS SHEAR TESTS FOR SOLDER JOINTS, Journal of electronic packaging, 120(1), 1998, pp. 106-113
Citation: M. Paulasto et J. Kivilahti, METALLURGICAL REACTIONS CONTROLLING THE BRAZING OF AL2O3 WITH AG-CU-TI FILLER ALLOYS, Journal of materials research, 13(2), 1998, pp. 343-352
Citation: P. Savolainen et J. Kivilahti, ELECTRICAL-PROPERTIES OF SOLDER FILLED ANISOTROPICALLY CONDUCTIVE ADHESIVES, JOURNAL OF ELECTRONICS MANUFACTURING, 5(1), 1995, pp. 19-26
Authors:
HAIMI E
TALVITIE M
RISTOLAINEN EO
KIVILAHTI J
LINDROOS VK
Citation: E. Haimi et al., CHARACTERIZATION OF INTERFACIAL LAYER BETWEEN NITROGEN ALLOYED STAINLESS-STEEL AND ALUMINA IN A METAL-MATRIX COMPOSITE, Scripta metallurgica et materialia, 30(10), 1994, pp. 1333-1336
Citation: M. Kononen et J. Kivilahti, BONDING OF LOW-FUSING DENTAL PORCELAIN TO COMMERCIALLY PURE TITANIUM, Journal of biomedical materials research, 28(9), 1994, pp. 1027-1035