Authors: Zhang, Q Xie, XM Chen, L Wang, GZ Cheng, ZN Kempe, W

Citation: Q. Zhang et al., On the degradation of the solder joints of underfilled flip chip packages:a case study, SOLDER S MT, 12(3), 2000, pp. 24-28

Authors: Ahat, S Du, LG Sheng, M Luo, L Kempe, W Freytag, J

Citation: S. Ahat et al., Effect of aging on the microstructure and shear strength of SnPbAg/Ni-P/Cuand SnAg/Ni-P/Cu solder joints, J ELEC MAT, 29(9), 2000, pp. 1105-1109