Login
|
New Account
AAAAAA
ITA
ENG
Results:
1-1
|
Results: 1
Diffusion bonding and brazing of high purity copper for linear collider accelerator structures - art. no. 053502
Authors:
Elmer, JW Klingmann, J Van Bibber, K
Citation:
Jw. Elmer et al., Diffusion bonding and brazing of high purity copper for linear collider accelerator structures - art. no. 053502, PHY R SPE T, 4(5), 2001, pp. NIL_12-NIL_27
Risultati:
1-1
|