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Results: 1-25 | 26-32 |
Results: 26-32/32
Plasma chemistry in fluorocarbon film deposition from pentafluoroethane/argon mixtures
Authors: Agraharam, S Hess, DW Kohl, PA Allen, SAB
Citation: S. Agraharam et al., Plasma chemistry in fluorocarbon film deposition from pentafluoroethane/argon mixtures, J VAC SCI A, 17(6), 1999, pp. 3265-3271
Microelectronics and ECS
Authors: Kohl, PA
Citation: Pa. Kohl, Microelectronics and ECS, J ELCHEM SO, 146(6), 1999, pp. NIL_1-NIL_1
Electrochemical etching of silicon in nonaqueous electrolytes containing hydrogen fluoride or fluoroborate
Authors: Flake, JC Rieger, MM Schmid, GM Kohl, PA
Citation: Jc. Flake et al., Electrochemical etching of silicon in nonaqueous electrolytes containing hydrogen fluoride or fluoroborate, J ELCHEM SO, 146(5), 1999, pp. 1960-1965
Alternatives to hydrogen fluoride for photoelectrochemical etching of silicon
Authors: Rieger, MM Flake, JC Kohl, PA
Citation: Mm. Rieger et al., Alternatives to hydrogen fluoride for photoelectrochemical etching of silicon, J ELCHEM SO, 146(12), 1999, pp. 4485-4489
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Authors: Kohl, PA
Citation: Pa. Kohl, Sign up now, J ELCHEM SO, 146(11), 1999, pp. NIL_1-NIL_1
Development of a new force field for polynorbornene
Authors: Ahmed, S Bidstrup, SA Kohl, PA Ludovice, PJ
Citation: S. Ahmed et al., Development of a new force field for polynorbornene, J PHYS CH B, 102(49), 1998, pp. 9783-9790
Air-gaps for electrical interconnections
Authors: Kohl, PA Zhao, Q Patel, K Schmidt, D Bidstrup-Allen, SA Shick, R Jayaraman, S
Citation: Pa. Kohl et al., Air-gaps for electrical interconnections, EL SOLID ST, 1(1), 1998, pp. 49-51
Risultati: 1-25 | 26-32 |